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1

Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectrics

Chang, Yu-Min, Chang, Wei-Yuan, Huang, Jun-Fu, Leu, Jihperng, Cheng, Yi-Lung

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 504 KB

english, 2013

2

Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications

Shih, Jian-Yu, Huang, Wen-Chun, Ko, Cheng-Ta, Yang, Zheng, Hu, Sheng-Hsiang, Leu, Jihperng, Chou, Keng C., Chen, Kuan-Neng

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.11 MB

english, 2014

3

Effect of NH3/N2 ratio in plasma treatment on porous low dielectric constant SiCOH materials

Huang, Jun-Fu, Bo, Tain-Cih, Chang, Wei-Yuan, Chang, Yu-Min, Leu, Jihperng, Cheng, Yi-Lung

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2014

Language:

english

File:

PDF, 1.27 MB

english, 2014

4

Effects of thermomechanical properties of polarizer components on light leakage in thin-film transistor liquid-crystal displays

Lin, Taiy-In, Chen, Alexander, Chen, Shou-I, Leu, Jihperng

Journal:

Japanese Journal of Applied Physics

Year:

2015

Language:

english

File:

PDF, 923 KB

english, 2015

5

Impact of plasma treatment on structure and electrical properties of porous low dielectric constant SiCOH material

Cheng, Yi-Lung, Huang, Jun-Fu, Chang, Yu-Min, Leu, Jihperng

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 397 KB

english, 2013

6

Optical properties of plasma-enhanced chemical vapor deposited SiC x N y films by using silazane precursors

Chang, Wei-Yuan, Chang, Chieh-Yu, Leu, Jihperng

Journal:

Thin Solid Films

Year:

2017

Language:

english

File:

PDF, 2.02 MB

english, 2017

7

Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface

Hsieh, Yen-Hui, Huang, Yen-Jun, Shih, Jian-Yu, Leu, Jihperng, Chen, Kuan-Neng

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 2.05 MB

english, 2018

8

Enhanced Photocatalytic Performance of Nitrogen-Doped TiO2 Nanotube Arrays Using a Simple Annealing Process

Le, Phuoc, Hieu, Le, Lam, Tu-Ngoc, Hang, Nguyen, Truong, Nguyen, Tuyen, Le, Phong, Pham, Leu, Jihperng

Journal:

Year:

2018

Language:

english

File:

PDF, 2.71 MB

english, 2018

9

Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films

Tseng, Chih-Han, Tseng, I-Hsin, Huang, Yu-Pei, Hsu, Yun-Ting, Leu, Jihperng, Tu, K.N., Chen, Chih

Journal:

Materials Characterization

Year:

2020

File:

PDF, 2.48 MB

2020

10

Effect of UV curing time on physical and electrical properties and reliability of low dielectric constant materials

Kao, Kai-Chieh, Chang, Wei-Yuan, Chang, Yu-Min, Leu, Jihperng, Cheng, Yi-Lung

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2014

Language:

english

File:

PDF, 1.37 MB

english, 2014

11

Effects of localized warpage and stress on chip-on-glass packaging: Induced light-leakage phenomenon in mid-sized TFT-LCD

Jihperng Leu, Chin-Cheng Chang, Alexander Chen, Mao-Hsing Lin, Kun-Feng Huang

Journal:

Journal of the Society for Information Display

Year:

2012

Language:

english

File:

PDF, 1.65 MB

english, 2012

12

Superior local conductivity in self-organized nanodots on indium-tin-oxide films induced by femtosecond laser pulses

Wang, Chih, Wang, Hsuan-I, Tang, Wei-Tsung, Luo, Chih-Wei, Kobayashi, Takayoshi, Leu, Jihperng

Journal:

Year:

2011

Language:

english

File:

PDF, 5.03 MB

english, 2011

13

Structural and morphological transformations of TiO2 nanotube arrays induced by excimer laser treatment

Ming-Yi Hsu, Nguyen Van Thang, Chih Wang, Jihperng Leu

Journal:

Thin Solid Films

Year:

2012

Language:

english

File:

PDF, 1.56 MB

english, 2012

14

Pore morphology of low-k SiCxNy films prepared with a cyclic silazane precursor using plasma-enhanced chemical vapor deposition

Tu, Hung-En, Su, Chun-Jen, Jeng, U-Ser, Leu, Jihperng

Journal:

Thin Solid Films

Year:

2015

Language:

english

File:

PDF, 1.28 MB

english, 2015

15

Growth and characterization of topological insulator Bi2Se3 thin films on SrTiO3 using pulsed laser deposition

Le, Phuoc Huu, Wu, Kaung Hsiung, Luo, Chih Wei, Leu, Jihperng

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 1.89 MB

english, 2013

16

Effect of surfactants on the porogen size in the low-k methylsilsesquioxane/polystyrene hybrid films

Yu-Han Chen, Hung-En Tu, Jihperng Leu

Journal:

Microporous and Mesoporous Materials

Year:

2012

Language:

english

File:

PDF, 978 KB

english, 2012

17

Ftir Investigations of Plasma Modified Polymer Surfaces and Their Interfaces with Plasma Deposited Tungsten

Leu, Jihperng, Dalvie, Manoj, Jensen, Klavs F.

Journal:

MRS Proceedings

Year:

1989

Language:

english

File:

PDF, 521 KB

english, 1989

18

Synthesis of Free-Standing Flexible rGO/MWCNT Films for Symmetric Supercapacitor Application

Kumar, Amit, Kumar, Nagesh, Sharma, Yogesh, Leu, Jihperng, Tseng, Tseung Yuen

Journal:

Nanoscale Research Letters

Year:

2019

Language:

english

File:

PDF, 7.39 MB

english, 2019

19

SiC x N y -based resistive and threshold switching by using single precursor plasma-enhanced atomic layer deposition

Hsu, Yu-Lin, Chang, Yao-Feng, Chung, Wei-Min, Chen, Ying-Chen, Lin, Chao-Cheng, Leu, Jihperng

Journal:

Applied Physics Letters

Year:

2020

File:

PDF, 1.11 MB

2020

20

[Springer Series in Advanced Microelectronics] Low Dielectric Constant Materials for IC Applications Volume 9 || || Front_matter

Ho, Paul S., Leu, Jihperng Jim, Lee, Wei William

Year:

2003

Language:

english

File:

PDF, 206 KB

english, 2003

21

Microstructure and Composition of TiO[sub 2] Nanotube Arrays Fabricated with HF and NH[sub 4]F Electrolytes and Their Evolution during Annealing

Hsu, Ming-Yi, Yang, Wei-Chun, Teng, Hsisheng, Leu, Jihperng

Journal:

Journal of The Electrochemical Society

Year:

2011

Language:

english

File:

PDF, 935 KB

english, 2011

22

FTIR and XPS Studies of Polyimide/Metal Interface Formation

Stewart, William C., Leu, Jihperng, Jensen, Klavs F.

Journal:

MRS Proceedings

Year:

1989

Language:

english

File:

PDF, 478 KB

english, 1989

23

[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Effects of passivation layer on stress relaxation in Cu line structures

Dongwen Gan,, Sean Yoon,, Ho, P.S., Cresta, P., Singh, N., Bower, A.F., Jihperng Leu,, Shankar, S.

Year:

2003

Language:

english

File:

PDF, 279 KB

english, 2003

24

Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low- k dielectrics using a late porogen removal scheme

Che, Mu-Lung, Huang, Cheng-Ying, Choang, Shindy, Chen, Yu-Hen, Leu, Jihperng

Journal:

Journal of Materials Research

Year:

2010

Language:

english

File:

PDF, 812 KB

english, 2010

25

Broadband UV-assisted thermal annealing of low- k silicon carbonitride films using a C-rich silazane precursor

Chang, Wei-Yuan, Chung, Hau-Ting, Chen, Yi-Chang, Leu, Jihperng

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2018

Language:

english

File:

PDF, 437 KB

english, 2018

26

Thermoelectric properties of bismuth-selenide films with controlled morphology and texture grown using pulsed laser deposition

Le, Phuoc Huu, Liao, Chien-Neng, Luo, Chih Wei, Lin, Jiunn-Yuan, Leu, Jihperng

Journal:

Applied Surface Science

Year:

2013

Language:

english

File:

PDF, 2.63 MB

english, 2013

27

[IEEE Eleventh Biennial University/Government/ Industry Microelectronics Symposium - Austin, TX, USA (16-17 May 1995)] Proceedings of the Eleventh Biennial University/Government/ Industry Microelectronics Symposium - Evaluation of low dielectric constant materials for on-chip interconnects-an industry/university research collaboration

Jihperng Leu,, Holland, S., Monnig, K.A., Ho, P.S.

Year:

1995

Language:

english

File:

PDF, 451 KB

english, 1995

28

ECS Transactions [ECS 219th ECS Meeting - Montreal, QC, Canada (May 1 - May 6, 2011)] - Synthesis, Pore Morphology, and Dielectric Property of Mesoporous Low-k Material PSMSQ Using a Reactive High-Temperature Porogen, TEPSS

Chiu, Shih-Ya, Hsu, Hsin-Ling, Che, Mu-Lung, Leu, Jihperng

Year:

2011

Language:

english

File:

PDF, 482 KB

english, 2011

29

In Situ Ftir Investigations of Polymer Surface Modification in Downstream Microwave Plasma Etching

Leu, Jihperng, Jensen, K.F.

Journal:

MRS Proceedings

Year:

1989

Language:

english

File:

PDF, 1.06 MB

english, 1989

30

[Springer Series in Advanced Microelectronics] Low Dielectric Constant Materials for IC Applications Volume 9 ||

Ho, Paul S., Leu, Jihperng Jim, Lee, Wei William

Year:

2003

Language:

english

File:

PDF, 206 KB

english, 2003

31

Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements

Gan, Dongwen, Ho, Paul S., Huang, Rui, Leu, Jihperng, Maiz, Jose, Scherban, Tracey

Journal:

Journal of Applied Physics

Year:

2005

Language:

english

File:

PDF, 785 KB

english, 2005

32

Thermoelectric properties of nanocrystalline Bi3Se2Te thin films grown using pulsed laser deposition

Cam Tuyen, Le Thi, Le, Phuoc Huu, Luo, Chih Wei, Leu, Jihperng

Journal:

Journal of Alloys and Compounds

Year:

2016

Language:

english

File:

PDF, 2.91 MB

english, 2016

33

In Situ FTIR Investigations Of Polymer Surface Modification In Downstream Microwave Plasma Etching

Leu, Jihperng, Jensen, K.F.

Journal:

MRS Proceedings

Year:

1989

Language:

english

File:

PDF, 525 KB

english, 1989

34

Effects of CF4 plasma treatment on the moisture uptake, diffusion, and WVTR of poly(ethylene terephthalate) flexible films

Chih Wang, Po-Cheng Lai, Shu Hao Syu, Jihperng Leu

Journal:

Surface and Coatings Technology

Year:

2011

Language:

english

File:

PDF, 580 KB

english, 2011

35

Superconductivity in textured Bi clusters/Bi2Te3 films

Le, Phuoc Huu, Tzeng, Wen-Yen, Chen, Hsueh-Ju, Luo, Chih Wei, Lin, Jiunn-Yuan, Leu, Jihperng

Journal:

Year:

2014

Language:

english

File:

PDF, 1.10 MB

english, 2014

36

Preparation and characterization of polyimide alternating copolymers incorporating N,N′-bis-(4-anilino)-1,2,4,5-benzene bis(dicarboximide)

Andrew J. McKerrow, Marye Anne Fox, Jihperng Leu, Paul S. Ho

Journal:

Journal of Polymer Science Part A: Polymer Chemistry

Year:

1997

Language:

english

File:

PDF, 811 KB

english, 1997

37

Thermoelectric properties of nanostructured bismuth–telluride thin films grown using pulsed laser deposition

Le, Phuoc Huu, Liao, Chien-Neng, Luo, Chih Wei, Leu, Jihperng

Journal:

Journal of Alloys and Compounds

Year:

2014

Language:

english

File:

PDF, 3.85 MB

english, 2014

38

Comparison of H2 and NH3 Treatments for Copper Interconnects

Chang, Yu-Min, Leu, Jihperng, Lin, Bing-Hong, Wang, Ying-Lung, Cheng, Yi-Lung

Journal:

Advances in Materials Science and Engineering

Year:

2013

Language:

english

File:

PDF, 5.38 MB

english, 2013

39

Effects of environmentally benign solvents in the agarose gel electrolytes on dye-sensitized solar cells

Hsin-Ling Hsu, Wan-Ting Hsu, Jihperng Leu

Journal:

Electrochimica Acta

Year:

2011

Language:

english

File:

PDF, 517 KB

english, 2011

40

Effect of moisture on electrical properties and reliability of low dielectric constant materials

Cheng, Yi-Lung, Leon, Ka-Wai, Huang, Jun-Fu, Chang, Wei-Yuan, Chang, Yu-Min, Leu, Jihperng

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.24 MB

english, 2014

41

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Novel pore-sealing technology in the preparation of low-k underfill materials for RF applications

Kuo-Yuan Hsu,, Jihperng Leu,

Year:

2008

Language:

english

File:

PDF, 678 KB

english, 2008

42

Fourier transform infrared studies of polyimide and poly(methyl-methacrylate) surfaces during downstream microwave plasma etching

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1991

Language:

english

File:

PDF, 1.23 MB

english, 1991

43

Effect of passivation on stress relaxation in electroplated copper films

Gan, Dongwen, Ho, Paul S., Pang, Yaoyu, Huang, Rui, Leu, Jihperng, Maiz, Jose, Scherban, Tracey

Journal:

Journal of Materials Research

Year:

2006

Language:

english

File:

PDF, 250 KB

english, 2006

44

4535061 Bacteria capable of dissimilation of environmentally persistent chemical compounds

Cheng, Yi-Lung, Leon, Ka-Wai, Huang, Jun-Fu, Chang, Wei-Yuan, Chang, Yu-Min, Leu, Jihperng

Journal:

Biotechnology Advances

Year:

1986

Language:

english

File:

PDF, 54 KB

english, 1986

45

Effect of pore size/distribution in TiO2films on agarose gel electrolyte-based dye-sensitized solar cells

Hsu, Hsin-Ling, Tien, Cheng-Fang, Leu, Jihperng

Journal:

Journal of Solid State Electrochemistry

Year:

2014

Language:

english

File:

PDF, 304 KB

english, 2014

46

THE HOSPITAL ADMINISTRATOR TODAY

Cheng, Yi-Lung, Leon, Ka-Wai, Huang, Jun-Fu, Chang, Wei-Yuan, Chang, Yu-Min, Leu, Jihperng

Journal:

Year:

1949

Language:

english

File:

PDF, 209 KB

english, 1949

47

Embedded carbon bridges in low- k PECVD silicon carbonitride films using silazane precursors

Chang, Wei-Yuan, Chen, Wei-Zhong, Lee, Hung-Tse, Leu, Jihperng

Journal:

Japanese Journal of Applied Physics

Year:

2019

Language:

english

File:

PDF, 667 KB

english, 2019

48

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Novel pore-sealing of ordered, porous silica, SBA-15 for low-k underfill materials

Hsu, Kuo-Yuan, Chen, Kuei-Yue, Cheng, Ching-Yuan, Lee, Jhih-Jhao, Leu, Jihperng

Year:

2009

Language:

english

File:

PDF, 925 KB

english, 2009

49

Effects of Methyl Terminal and Carbon Bridging Groups Ratio on Critical Properties of Porous Organosilicate Glass Films

Vishnevskiy, Alexey S., Naumov, Sergej, Seregin, Dmitry S., Wu, Yu-Hsuan, Chuang, Wei-Tsung, Rasadujjaman, Md, Zhang, Jing, Leu, Jihperng, Vorotilov, Konstantin A., Baklanov, Mikhail R.

Journal:

Year:

2020

File:

PDF, 5.34 MB

2020

50

Effect of layout on electromigration characteristics in copper dual damascene interconnects

Cheng, Y.L., Chang, Y.M., Leu, Jihperng, Bo, T.C., Wang, Y.L.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.29 MB

english, 2014

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